SMD implantation
TRANSFORM YOUR ELECTRONICS MANUFACTURING WITH INDUSTRY-LEADING SMD TECHNOLOGYPrecision Surface Mount Assembly with Zero-Defect Guarantee Request a Quote | ||||||
| ||||||
| ||||||
| ||||||
Beyond Standard Manufacturing: Your Strategic PartnerThrough our first-time-right manufacturing approach and zero defect rates in critical applications, we deliver significant cost savings and enhanced product reliability. Our optimized design for manufacturing process reduces time-to-market while ensuring superior performance in every component. | ||||||
TRANSFORM YOUR ELECTRONICS MANUFACTURING WITH INDUSTRY-LEADING SMD TECHNOLOGY
Precision Surface Mount Assembly with Zero-Defect Guarantee
Request a Quote
In today's demanding electronics manufacturing landscape, component reliability can make or break your product's success. At Silveria, we've revolutionized Surface Mount Device (SMD) manufacturing through our proprietary 5+1 stage testing protocol, delivering unprecedented 100% defect-free guarantees that eliminate costly manufacturing risks and production delays.
Why Industry Leaders Trust Silveria's SMD Expertise
Our state-of-the-art facility combines advanced Japanese AOI technology with precision BGA implementation, achieving placement accuracy down to 30μm. This exceptional precision is backed by comprehensive ICT and FCT testing protocols, ensuring every component meets exact specifications before leaving our facility.
Design Validation Production (DVP)
Pre-production validation ensures manufacturability and optimal component placement, eliminating costly design iterations.
First Piece Check (FPC)
Rigorous inspection of initial production pieces guarantees precise alignment with specifications before full production begins.
Automatic Optical Inspection (AOI)
SONY-powered inspection system captures high-resolution images of every 2x2cm section, detecting even microscopic deviations.
Manual Expert Verification
Our certified technicians perform detailed visual inspections under magnification, ensuring perfection in hand-assembled components.
FCT & ICT Testing
Comprehensive electrical parameter verification and functional testing simulate real-world operating conditions.
X-Ray Inspection
Advanced X-ray analysis provides 3D imaging with 1μm resolution, ensuring perfect BGA and μBGA solder joints.
Beyond Standard Manufacturing: Your Strategic Partner
Through our first-time-right manufacturing approach and zero defect rates in critical applications, we deliver significant cost savings and enhanced product reliability. Our optimized design for manufacturing process reduces time-to-market while ensuring superior performance in every component.