Equipment
Machine & Technology Park
Our technology backbone is a key pillar of the Synergy 360 Electronics Services philosophy: it lets us build a tailored manufacturing ecosystem for every customer product. This park enables flexible, reliable production across different product types and supports fast changeovers – handling medium- and high-volume products with the same precision – with integrated quality checkpoints and a digitally monitored workflow.

Automated SMT production lines

Capacity: 80,000 CPH
Soldering: Lead-free, 20-zone top & bottom reflow oven
Inspection: In-line AOI & SPI

Capacity: 60,000 CPH
Soldering: Lead-free, 20-zone top & bottom reflow oven
Inspection: In-line AOI & SPI

Capacity: 60,000 CPH
Soldering: Lead-free, 18-zone top & bottom reflow oven
Inspection: In-line AOI

Capacity: 80,000 CPH
Soldering: Lead-free, 18-zone top & bottom reflow oven
Inspection: In-line SPI & AOI
THT assembly

Targeted soldering where the machine solders only predefined points – ideal for mixed-technology PCBs.
SEHO SelectLine Dual Pot
precision selective soldering system with automated fluxing, preheating and soldering
ERSA VERSAFLOW 4/55 Dual Pot
dual-pot system for parallel processes; high variability and flexibility

A cost-effective mass-production method for standard THT, where the PCB passes through a solder wave.
SEHO Powerwave (nitrogen technology)
reliable wave-soldering system for series production
ERSA Powerflow Pro (nitrogen tunnel wave)
closed-chamber N₂ system for optimised solder quality and low oxidation

For delicate, small-batch or special tasks and THT rework.
Performed by highly trained operators
Work executed according to defined competency levels
Internal training ensures continuous skill refresh and quality assurance
Complementary Technologies

Four-axis tilt/rotate dispensing valve
Multiple materials on a single system
Enclosed, controlled process
Three-head motion system
Variable-speed conveyor
Thermocouple-based process control with independent over-temperature protection
Infeed/outfeed units for hands-free automated handling

Circular blade depaneling enables fast, precise, and gentle separation of printed circuit boards. The process minimizes mechanical stress on the PCB and assembled components, reducing the risk of damage and microcracks. It is particularly well suited for series production where consistent quality and high productivity are essential.

3-axis automatic depaneliser (routing)
0.08 mm routing accuracy
PCB sizes 50 × 50 to 400 × 350 mm
Max panel thickness: 4.5 mm
Product-specific fixtures

Closed-loop, rotary-arm, water-jet “dishwasher-style” system
One wash, two separate rinse stages and hot-air dry cycle
Detergent formulated specifically for PCB cleaning
Continuous rinse-water quality monitoring (contamination-level measurement)
Cable harnessing

Schleuniger CC36S – automatic cut/strip/crimp station for precision cable preparation

Automatic and semi-automatic cable processing machines for cutting and stripping applications
Semi-automatic crimping stations

Crimping – connector crimping performed manually or with hydraulic tools
Housing assembly – wire and terminal insertion, connector assembly
End tinning – tin coating of cable ends for solderability and contact reliability
Other assembly – bespoke, small-batch or complex manual builds